Bond-1™ SF Solvent-Free SE Adhesive Syringe

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SKU
N03N

2 x 1ml Syringes, 20 x 25 Gauge Flocked Needle Tips

Bond-1™ SF is a self-etch, one-coat bonding agent that is solvent-free — eliminating the need to air dry. This feature protects against sensitivity and prevents evaporation for stability and consistency. Bond-1™ SF is designed for direct composite restorations and dual cure materials. * Bond-1™ SF provides optimal bond strengths up to 30.4 MPa in just three basic steps: apply evenly, rub for 20 seconds, and light cure. Bond-1™ SF Solvent-Free SE Adhesive is available in a convenient syringe delivery system, offering unique flocked needle tips that facilitate easy, direct placement into the prep.

Features & Benefits:

  • Solvent-free – Protects against sensitivity, eliminating common technique-sensitive issues such as under and over drying. Also prevents evaporation
  • No air drying – Saves you precious chair time; doesn’t leave you guessing “how dry is too dry”
  • Self-etch – No need to acid etch, saves time
  • Versatile – Bond-1 SF is perfect for all your direct composite bonding needs and can also be used with dual-cure materials when the initial layer of dual-cure material is light cured
  • Unique handling properties – Enables an even spread of the material, ensuring a complete coverage and optimal results
  • One coat – Easy to use, reduces procedure tim
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