Bond-1™ SF Solvent-Free SE Adhesive Syringe

Bond-1™ SF is a self-etch, one-coat bonding agent that is solvent-free — eliminating the need to air dry. This feature protects against sensitivity and prevents evaporation for stability and consistency. Bond-1™ SF is designed for direct composite restorations and dual cure materials. * Bond-1™ SF provides optimal bond strengths up to 30.4 MPa in just three basic steps: apply evenly, rub for 20 seconds, and light cure. Bond-1™ SF Solvent-Free SE Adhesive is available in a convenient syringe delivery system, offering unique flocked needle tips that facilitate easy, direct placement into the prep.

Features & Benefits:

• Solvent-free – Protects against sensitivity, eliminating common technique-sensitive issues such as under and over drying. Also prevents evaporation
• No air drying – Saves you precious chair time; doesn’t leave you guessing “how dry is too dry”
• Self-etch – No need to acid etch, saves time
• Versatile – Bond-1 SF is perfect for all your direct composite bonding needs and can also be used with dual-cure materials when the initial layer of dual-cure material is light cured
• Unique handling properties – Enables an even spread of the material, ensuring a complete coverage and optimal results
• One coat – Easy to use, reduces procedure tim